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AmazonのTrainium3がAIチップ戦争に挑戦状を叩きつける

Trainium3がTSMC 3nmプロセスで出荷開始。チップあたりFP8で2.52 PFLOPS、144GB HBM3e搭載。フルUltraServer（144チップ）で362 PFLOPSを実現。Anthropic、Decart、Amazon Bedrockが本番ワークロードを稼働中。顧客はGPU代替と比較して50%のコスト削減を報告...

Blake Crosley Blake Crosley
AmazonのTrainium3がAIチップ戦争に挑戦状を叩きつける
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